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we have the fine processing technology for many kinds of material

  Besides the PCB, MITS have a proven track record of achieving the fine processing thinner
than 100µm on the surface of many materials as following;
These processing consist of a lot of know-how, such as "stepping process technology"
in Z-axis

Silicon wafer
Strontium titanate (100)
Even on the extremely thin
circuit board
Glass material
Magnified picture

50µm(2mil) line and space, the state of the art!

FP-21T Precision
Stepping method and non-contacting pressure foot lead to the fine processing technology

MITS General Catalog

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MITS Electronics


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