We would like to report the result of the experiment of through-hole
formation by using the conductive paste in MITS. The conductive
paste we used in this experiment is ACP-051 made by Asahi Chemical
Research Laboratory Co.,Ltd Please go to http://www.asahi-kagaku.co.jp/english/product/polymer.html#1
for more information.
The report of through-hole formation using
the conductive paste
|Procedure of double-side
||The drilling process
First, make holes by drilling, then be sure to remove the
||Paste coating process
Viscosity control. Attenuate paste by thinner into dilution
rate 5 %.
Fill the paste all over the substrate board by squeegee.
In order to prevent the paste from remaining on the substrate
board aside from the through-hole, you have to remove the
paste by squeegee thoroughly.
Perform 90 minutes in 60 degrees C.
In case that preliminary drying is not sufficient, it emerges
void inside of the through-hole, leading to cause the poor
Perform 30 minutes in 150 degrees C.
Remove the oxide film from the copper foil surface after
Removal of the oxide film should be done by the acid treatment
instead of the physical ablation. (In this experiment, we
used the detergent for the bathroom.)
||Processing circuit pattern
Process the circuit. It requires the accurate position adjustment.
|Cross-section surface of the through-hole
50µm(2mil) line and space, the
state of the art!
Stepping method and non-contacting pressure foot lead to
the fine processing technology
(PDF file / 1.8MB)
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