Multi-layer board making systems
These systems let you make multi-layer trial boards at
low cost.
| Multi-layer
Boards using the Milling Method |
This example describes a 4-layer milling procedure
in which layers 2 and 3 are
a double-sided board and layers 1 and 4 are thin-pressed
copper plating.
|
1. Mill the 2nd and 3rd layers
|
Mill the inner layers first. The inner
2nd and 3rd layers represent data for a double-sided
board.
(If through holes are present only in the 2nd and 3rd
layers, please finish these first.)
|
2. Press
|
Apply copper plating onto both sides
and press onto the surface. This is accomplished with
the MITS Pressing Machine.
|
3. Drill the holes
|
Use the MITS PC board maker to drill the
holes.
|
4. Plate the through holes
|
The through holes are plated in a MITS
plating bath.
|
5. Mill the 1st and 4th layers
|
Mill the pattern on the 1st and 4th layers,
then mill the external shape.
|
|
|
MITS
General Catalog
English
(PDF file / 1.8MB)
MITS Electronics
5-1-9, Kajino-cho, Koganei-shi,
Tokyo 184-0002 JAPAN
TEL.+81 (0) 42 388 1051
FAX.+81 (0) 42 388 1060
E-MAIL
Contact us : Inquiry Form
|
