1. Mill the 2nd and 3rd layers
|
Mill the inner layers first.
The inner 2nd and 3rd layers represent data for a double-sided board.
(If through holes are present only in the 2nd and 3rd layers, please finish
these first.)
|
2. Press
|
Apply copper plating onto
both sides and press onto the surface. This is accomplished with the MITS
Pressing Machine.
|
3. Drill the holes
|
Use the MITS PC board maker
to drill the holes.
|
4. Plate the through holes
|
The through holes are plated
in a MITS plating bath.
|
5. Mill the 1st and 4th layers
|
Mill the pattern on the 1st
and 4th layers, then mill the external shape.
|
|
